The semiconductor industry has some of the most demanding applications in motion control. A combination of extreme accuracy and precision combined with high throughput, makes for exciting technology. Semiconductor processing can be divided into two parts - "front-end" and "back-end". Front-end refers to the fabrication from a blank wafer to a completed wafer (i.e. the microchips are created but they are still on the wafer). Back-end refers to dicing the wafer into individual chips and all the processes thereafter; such as test, assembly and packaging.